Below are the basic specifications of the HiSilicon Kirin 810 processor developed on the architecture. The serial production start date Q2/2019, the technological process 12 nm, the clock frequency 1.90 GHz. The CPU has 8 cores, overclocked clock speed 2.20 GHz.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.
HiSilicon Kirin 810 review - Specs and Benchmarks
with others processors Key data
Overview of the HiSilicon Kirin 810 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.
CPU generation and family
Processor nomenclature, family, group and segment.
| Name: | HiSilicon Kirin 810 | Segment: | Mobile | |
| CPU group: | HiSilicon Kirin 810/820 | |||
| Family: | HiSilicon Kirin | Generation: | 1 | |
| Predecessor: | -- | Successor: | -- | |
CPU Cores and Base Frequency
Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.
| Frequency: | 1.90 GHz | CPU Cores: | 8 | |
| Turbo (1 Core): | 2.20 GHz | CPU Threads: | 8 | |
| Hyperthreading: | No | Overclocking: | No | |
| Turbo (8 Cores): | 2.20 GHz | Core architecture: | hybrid (big.LITTLE) | |
| A core: | 2x Cortex-A76 | B core: | 6x Cortex-A55 | |
| C core: | -- |
Internal Graphics
The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better.
| GPU name: | ARM Mali-G52 MP6 | |||
| GPU frequency: | 0.85 GHz | GPU (Turbo): | No turbo | |
| Generation: | Bifrost 2 | DirectX Version: | 12 | |
| Execution units: | 16 | Shader: | 288 | |
| Max. displays: | 2 | Technology: | 12 nm | |
| Release date: | Q1/2018 | Max. GPU Memory: | 4 GB | |
Hardware codec support
Technical information that will be of interest to specialists and does not affect the performance of the processor.
| h264: | Decode / Encode | |||
| JPEG: | Decode / Encode | |||
| VP8: | Decode / Encode | |||
| VP9: | Decode / Encode | |||
| VC-1: | Decode / Encode | |||
| AVC: | Decode / Encode | |||
| h265 / HEVC (8 bit): | Decode / Encode | |||
| h265 / HEVC (10 bit): | Decode / Encode | |||
| AV1: | No | |||
Memory & PCIe
The interfaces and standards of RAM that the HiSilicon Kirin 810 processor supports. The more modern the standard and the larger the memory capacity, the better.
| Memory type: | LPDDR4X-2133 | Max. Memory: | 6 GB | |
| Memory channels: | 4 | ECC: | No |
Encryption
Data encryption standards supported by CPUs
| AES-NI: | No |
Thermal Management
TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.
| Tjunction max.: | -- | TDP up: | -- | |
| TDP down: | -- | TDP (PL1): | 5 W | |
| TDP (PL2): | -- |
Technical details
Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.
| L3-Cache: | 1.00 MB | Technology: | 7 nm | |
| Virtualization: | None | Socket: | N/A | |
| Release date: | Q2/2019 | Instruction set (ISA): | x86-64 (64 bit) | |
| L2-Cache: | -- | |||
| Part Number: | -- | |||
Devices using this processor
Devices that can use this type of processor, desktop or laptop.
| Used in: | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite | |||
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HiSilicon Kirin 810
