Qualcomm Snapdragon 860 review - Specs and Benchmarks

Below are the basic specifications of the Qualcomm Snapdragon 860 processor developed on the Kryo 485 architecture. The serial production start date Q1/2021, the technological process 7 nm, the clock frequency 1.80 GHz. The CPU has 8 cores, overclocked clock speed 2.96 GHz.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Qualcomm Snapdragon 860 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: Qualcomm Snapdragon 860   Segment: Mobile
CPU group: Qualcomm Snapdragon 855/860
Family: Qualcomm Snapdragon   Generation: 6
Predecessor: Qualcomm Snapdragon 855+   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 1.80 GHz   CPU Cores: 8
Turbo (1 Core): 2.96 GHz   CPU Threads: 8
Hyperthreading: No   Overclocking: No
Turbo (8 Cores): 2.42 GHz   Core architecture: hybrid (Prime / big.LITTLE)
A core: 1x Kryo 485 Prime   B core: 3x Kryo 485 Gold
C core: 4x Kryo 485 Silver  

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: Qualcomm Adreno 640
GPU frequency: 0.25 GHz   GPU (Turbo): 0.68 GHz
Generation: 5   DirectX Version: 12.0
Execution units: 4   Shader: 384
Max. displays: 1   Technology: 7 nm
Release date: Q1/2019   Max. GPU Memory: 4 GB

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: Decode / Encode
JPEG: No
VP8: Decode / Encode
VP9: Decode / Encode
VC-1: No
AVC: No
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
AV1: No

Memory & PCIe

Memory type: LPDDR4X-2133   Max. Memory: 16 GB
ECC: No   Memory channels: 4

Encryption

Data encryption standards supported by CPUs

AES-NI: No  

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL2): --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 3.00 MB   Technology: 7 nm
Architecture: Kryo 485   Virtualization: None
Socket: N/A   Release date: Q1/2021
Instruction set (ISA): ARMv8-A64 (64 bit)   L2-Cache: 2.00 MB
Part Number: SM8150-AC

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Used in: Unknown
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