Below are the basic specifications of the AMD Phenom II X4 965 processor developed on the Deneb architecture. The serial production start date Q3/2009, the technological process 45nm, the clock frequency 3.40 GHz. The CPU has 4 cores, overclocked clock speed No turbo.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.
AMD Phenom II X4 965 review - Specs and Benchmarks
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Key data
Overview of the AMD Phenom II X4 965 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.
CPU Cores and Base Frequency
Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.
| Frequency: | 3.40 GHz | CPU Cores: | 4 | |
| Turbo (1 Core): | No turbo | CPU Threads: | 4 | |
| Hyperthreading: | No | Overclocking: | Yes | |
| Turbo (4 Cores): | No turbo |
Internal Graphics
The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better.
| GPU (Turbo): | No turbo | Max. Memory: | -- |
Hardware codec support
Technical information that will be of interest to specialists and does not affect the performance of the processor.
| h264: | No | |||
| JPEG: | No | |||
| h265 8bit: | No | |||
| h265 10bit: | No | |||
| VP8: | No | |||
| VP9: | No | |||
| VC-1: | No | |||
| AVC: | No | |||
Memory & PCIe
The interfaces and standards of RAM that the AMD Phenom II X4 965 processor supports. The more modern the standard and the larger the memory capacity, the better.
| Memory type: | DDR2-1066 | Memory channels: | 2 | |
| ECC: | No |
Encryption
Data encryption standards supported by CPUs
| AES-NI: | No |
Thermal Management
TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.
| TDP: | 140 W | Tjunction max.: | -- | |
| TDP up: | -- | TDP down: | -- |
Technical details
Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.
| L3-Cache: | 6.00 MB | Technology: | 45nm | |
| Architecture: | Deneb | Virtualization: | AMD-V, AMD-RVI | |
| Socket: | AM3 | Release date: | Q3/2009 |
Devices using this processor
Devices that can use this type of processor, desktop or laptop.
| Used in: | Unknown | |||
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AMD Phenom II X4 965
