HiSilicon Kirin 9000
VS
Qualcomm Snapdragon 888
HiSilicon Kirin 9000
VS
Qualcomm Snapdragon 888

Which to select

What to choose and what is the difference between HiSilicon Kirin 9000 and Qualcomm Snapdragon 888? Which processor is more powerful and faster to accomplish your task? The processor with the best specifications and a winner in benchmarks is your choice!

CPU generation and family

Processor nomenclature, family, group and segment.

HiSilicon Kirin 9000
Name
Qualcomm Snapdragon 888
Mobile
Segment
Mobile
HiSilicon Kirin 9000
CPU group
Qualcomm Snapdragon 888
HiSilicon Kirin
Family
Qualcomm Snapdragon
8
Generation
5
--
Predecessor
--
--
Successor
--

CPU Cores and Base Frequency

What to choose HiSilicon Kirin 9000 or Qualcomm Snapdragon 888? The greater the value of the characteristic (highlighted in green), the better.

2.05 GHz
Frequency
1.80 GHz
8
CPU Cores
8
3.13 GHz
Turbo (1 Core)
2.84 GHz
8
CPU Threads
8
No
Hyperthreading
No
No
Overclocking
No
2.54 GHz
Turbo (8 Cores)
2.40 GHz
hybrid (Prime / big.LITTLE)
Core architecture
hybrid (Prime / big.LITTLE)
1x Cortex-A77
A core
1x Cortex-X1
3x Cortex-A77
B core
3x Cortex-A78
4x Cortex-A55
C core
4x Cortex-A55

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. Determine the winner, who has the better chip? HiSilicon Kirin 9000 or Qualcomm Snapdragon 888. 

ARM Mali-G78 MP24
GPU name
Qualcomm Adreno 660
0.76 GHz
GPU frequency
0.84 GHz
No turbo
GPU (Turbo)
No turbo
Vallhall 2
Generation
6
12
DirectX Version
12.1
24
Execution units
0
384
Shader
0
1
Max. displays
0
5 nm
Technology
5 nm
Q4/2020
Release date
Q1/2021
--
Max. GPU Memory
--

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor. It can be skipped in the comparison.

Decode / Encode
h264
Decode / Encode
Decode / Encode
JPEG
Decode / Encode
Decode / Encode
VP8
Decode / Encode
Decode / Encode
VP9
Decode / Encode
Decode / Encode
VC-1
Decode
Decode / Encode
AVC
Decode
Decode / Encode
h265 / HEVC (8 bit)
Decode / Encode
Decode / Encode
h265 / HEVC (10 bit)
Decode / Encode
Decode
AV1
No

Memory & PCIe

The interfaces and standards of RAM that the processor supports. The more modern the standard and the larger the memory capacity, the better.

LPDDR4X-2133 LPDDR5-2750
Memory type
LPDDR4X-4266 LPDDR5-3200
4
Memory channels
4
No
ECC
No

Memory & PCIe

Encryption

Data encryption standards supported by CPUs

No
AES-NI
No

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

--
Tjunction max.
--
--
TDP up
--
--
TDP down
--
--
TDP (PL2)
--

Technical details

These are key parameters that will help you determine which CPU is better. Pay special attention to the release date, technological aspects of the manufacturing process (measured in nanometers), and the third-level cache (L3).

--
L3-Cache
8.00 MB
5 nm
Technology
5 nm
Architecture
Kryo 680
None
Virtualization
None
N/A
Socket
N/A
Q4/2020
Release date
Q1/2021
x86-64 (64 bit)
Instruction set (ISA)
x86-64 (64 bit)
--
L2-Cache
1.00 MB
--
Part Number
--

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Unknown
Used in
Unknown

User rating

0.0 Out of 0 CpusData Score HiSilicon Kirin 9000
0.0 Out of 0 CpusData Score Qualcomm Snapdragon 888