UNISOC T700 review - Specs and Benchmarks

Below are the basic specifications of the UNISOC T700 processor developed on the architecture. The serial production start date Q1/2021, the technological process 16 nm, the clock frequency 1.80 GHz. The CPU has 8 / 8 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the UNISOC T700 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: UNISOC T700   Segment: Mobile
CPU group: UNISOC 4G 12nm
Family: UNISOC 4G   Predecessor: --
Successor: --  

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Overclocking: No   Core architecture: hybrid (big.LITTLE)
CPU Cores / Threads: 8 / 8
A-Core: 2x Cortex-A75
B-Core: 6x Cortex-A55
Hyperthreading / SMT: No
A-Core Frequency: 1.80 GHz
B-Core Frequency: 1.80 GHz

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: ARM Mali-G52 MP2
GPU frequency: 0.85 GHz   GPU (Turbo): No turbo
Generation: Bifrost 2   Execution units: 2
Shader: 32   Max. displays: 2
Technology: 16 nm   Release date: Q3/2020
Max. GPU Memory: --  
Direct X: 12

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: Decode / Encode
JPEG: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
VC-1: Decode / Encode
AVC: Decode / Encode
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the UNISOC T700 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: LPDDR3-933LPDDR4-1866LPDDR4X-1866   ECC: No
Bandwidth: --
AES-NI: No

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL2): --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: --   Technology: 12 nm
Virtualization: None   Socket: --
Release date: Q1/2021   Instruction set (ISA): ARMv8-A64 (64 bit)
L2-Cache: --  
Part Number: --
Operating systems: Android
Release price: --
Documents: --
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