UNISOC SC9863A review - Specs and Benchmarks

Below are the basic specifications of the UNISOC SC9863A processor developed on the architecture. The serial production start date Q2/2019, the technological process 20 nm, the clock frequency 1.20 GHz. The CPU has 8 / 8 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the UNISOC SC9863A processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: UNISOC SC9863A   Segment: Mobile
CPU group: UNISOC 4G 28nm
Family: UNISOC 4G   Predecessor: --
Successor: --  

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Overclocking: No   Core architecture: hybrid (big.LITTLE)
CPU Cores / Threads: 8 / 8
A-Core: 4x Cortex-A55
B-Core: 4x Cortex-A55
Hyperthreading / SMT: No
A-Core Frequency: 1.20 GHz
B-Core Frequency: 1.60 GHz

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: PowerVR GE8322
GPU frequency: 0.55 GHz   GPU (Turbo): No turbo
Execution units: 1   Max. displays: 1
Technology: 20 nm   Release date: Q1/2017
Max. GPU Memory: --  
Direct X: 10

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the UNISOC SC9863A processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: LPDDR3LPDDR4LPDDR4X   ECC: No
Bandwidth: --
AES-NI: No

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL2): --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: --   Technology: 28 nm
Virtualization: None   Socket: --
Release date: Q2/2019   Instruction set (ISA): ARMv8-A64 (64 bit)
L2-Cache: --  
Part Number: --
Operating systems: Android
Release price: --
Documents: --
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