Qualcomm Snapdragon 678 review - Specs and Benchmarks

Below are the basic specifications of the Qualcomm Snapdragon 678 processor developed on the Kryo 460 architecture. The serial production start date Q4/2020, the technological process 11 nm, the clock frequency 1.70 GHz. The CPU has 8 cores, overclocked clock speed 2.20 GHz.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Qualcomm Snapdragon 678 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: Qualcomm Snapdragon 678   Segment: Mobile
CPU group: Qualcomm Snapdragon 675/678
Family: Qualcomm Snapdragon   Generation: 7
Predecessor: Qualcomm Snapdragon 675   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 1.70 GHz   CPU Cores: 8
Turbo (1 Core): 2.20 GHz   CPU Threads: 8
Hyperthreading: No   Overclocking: No
Turbo (8 Cores): 1.70 GHz   Core architecture: hybrid (big.LITTLE)
A core: 2x Kryo 460 Gold   B core: 6x Kryp 460 Silver
C core: --  

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: Qualcomm Adreno 612
GPU frequency: 0.85 GHz   GPU (Turbo): 0.85 GHz
Generation: 6   DirectX Version: 12.1
Technology: 11 nm   Max. GPU Memory: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: Decode / Encode
JPEG: Decode / Encode
VP8: Decode
VP9: Decode
VC-1: Decode
AVC: Decode
h265 / HEVC (8 bit): Decode
h265 / HEVC (10 bit): Decode
AV1: No

Memory & PCIe

Memory type: LPDDR4X-1866   ECC: No
Memory channels: 2  

Encryption

Data encryption standards supported by CPUs

AES-NI: No  

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL2): --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: --   Technology: 11 nm
Architecture: Kryo 460   Virtualization: None
Socket: N/A   Release date: Q4/2020
Instruction set (ISA): ARMv8-A64 (64 bit)   L2-Cache: --
Part Number: SM6150-AC

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Used in: Xiaomi Redmi Note 10 Motorola Moto G Stylus 2021
0.0 Out of 0 CpusData Score Qualcomm Snapdragon 678