Intel Xeon w9-3475X review - Specs and Benchmarks

Below are the basic specifications of the Intel Xeon w9-3475X processor developed on the Sapphire Rapids-WS architecture. The serial production start date Q1/2023, the technological process 10 nm, the clock frequency 2.20 GHz. The CPU has 36 / 72 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Intel Xeon w9-3475X processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: Intel Xeon w9-3475X   Segment: Desktop / Server
CPU group: Intel Xeon W-3400
Family: Intel Xeon W   Generation: 12
Predecessor: Intel Xeon W-3375   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 2.20 GHz   Overclocking: Yes
Core architecture: normal  
CPU Cores / Threads: 36 / 72
Hyperthreading / SMT: Yes
Cores: 36x
Turbo Frequency (1 Core): 4.80 GHz
Turbo Frequency (36 Cores): 3.00 GHz

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: no iGPU
GPU (Turbo): No turbo   Max. GPU Memory: --
Direct X: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the Intel Xeon w9-3475X processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR5-4800   Max. Memory: 4096 GB
Memory channels: 8 (Octa Channel)   ECC: Yes
Bandwidth: 307.2 GB/s
PCIe: 5.0 x 112
AES-NI: Yes

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: 95 °C   TDP up: 360 W
TDP down: --   TDP (PL2): --
TDP (PL1 / PBP): 300 W

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 82.50 MB   Technology: 10 nm
Architecture: Sapphire Rapids-WS   Virtualization: VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise
Socket: LGA 4677   Release date: Q1/2023
Instruction set (ISA): x86-64 (64 bit)   L2-Cache: --
Part Number: --
ISA extensions: SSE4.1, SSE4.2, AVX2, AVX-512, AMX
Chip design: Monolithic
Operating systems: Windows 11, Windows Server, Linux
Release price: 3739 $
Documents: Technical data sheet
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