Intel Xeon Platinum 8180M review - Specs and Benchmarks

Below are the basic specifications of the Intel Xeon Platinum 8180M processor developed on the Skylake SP architecture. The serial production start date Q3/2017, the technological process 14 nm, the clock frequency 2.50 GHz. The CPU has 28 cores, overclocked clock speed 3.80 GHz.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Intel Xeon Platinum 8180M processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 2.50 GHz   CPU Cores: 28
Turbo (1 Core): 3.80 GHz   CPU Threads: 56
Hyperthreading: Yes   Overclocking: No
Core architecture: normal   A core: 0x
B core: 0x   Turbo (28 Cores): 2.80 GHz

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU (Turbo): No turbo   Max. Memory: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the Intel Xeon Platinum 8180M processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR4-2666   Memory channels: 6
ECC: Yes   PCIe version: 3.0
PCIe lanes: 48  

Encryption

Data encryption standards supported by CPUs

AES-NI: Yes  

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL1): 205 W
TDP (PL2): --  

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 39.00 MB   Technology: 14 nm
Architecture: Skylake SP   Virtualization: VT-x, VT-x EPT, VT-d, vPro
Socket: LGA 3647   Release date: Q3/2017
Market price: ca. 13000 $   Instruction set (ISA): x86-64 (64 bit)
L2-Cache: --  

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Used in: Unknown
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