Intel Xeon E3-1270 review - Specs and Benchmarks

Below are the basic specifications of the Intel Xeon E3-1270 processor developed on the Sandy-Bridge architecture. The serial production start date Q2/2011, the technological process 32 nm, the clock frequency 3.40 GHz. The CPU has 4 / 8 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Intel Xeon E3-1270 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: Intel Xeon E3-1270   Segment: Desktop / Server
CPU group: Intel Xeon E3
Family: Intel Xeon E3   Generation: 2
Predecessor: --   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 3.40 GHz   Overclocking: No
Core architecture: normal  
CPU Cores / Threads: 4 / 8
Hyperthreading / SMT: Yes
Cores: 4x
Turbo Frequency (1 Core): 3.80 GHz
Turbo Frequency (4 Cores): 3.60 GHz

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: no iGPU
GPU (Turbo): No turbo   Max. GPU Memory: --
Direct X: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the Intel Xeon E3-1270 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR3-1333   Max. Memory: 32 GB
Memory channels: 2 (Dual Channel)   ECC: Yes
Bandwidth: 21.3 GB/s
PCIe: 2.0 x 20
AES-NI: Yes

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: --   TDP up: --
TDP down: --   TDP (PL2): --
TDP (PL1 / PBP): 80 W

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 8.00 MB   Technology: 32 nm
Architecture: Sandy-Bridge   Virtualization: VT-x, VT-x EPT, VT-d
Socket: LGA 1155   Release date: Q2/2011
Instruction set (ISA): x86-64 (64 bit)   L2-Cache: --
Part Number: --
ISA extensions: SSE4.1, SSE4.2, AVX
Chip design: Monolithic
Operating systems: Windows 10, Linux
Release price: 339 $
Documents: Technical data sheet
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