Intel Pentium g860 review - Specs and Benchmarks

Below are the basic specifications of the Intel Pentium g860 processor developed on the Sandy Bridge architecture. The serial production start date Q3/2011, the technological process 32 nm, the clock frequency 3.00 GHz. The CPU has 2 cores, overclocked clock speed No turbo.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Intel Pentium g860 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 3.00 GHz   CPU Cores: 2
Turbo (1 Core): No turbo   CPU Threads: 2
Turbo (2 Cores): No turbo   Hyperthreading: No
Overclocking: No  

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: Intel HD Graphics (Sandy Bridge GT1)
GPU frequency: 0.85 GHz   GPU (Turbo): 1.10 GHz
Generation: 6   DirectX Version: 10.1
Execution units: 6   Shader: 48
Max. Memory: --   Max. displays: 2
Technology: 32 nm   Release date: Q2/2011

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: Decode / Encode
JPEG: No
h265 8bit: No
h265 10bit: No
VP8: No
VP9: No
VC-1: Decode
AVC: No

Memory & PCIe

The interfaces and standards of RAM that the Intel Pentium g860 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR3-1066 DDR3-1333   Max. Memory: 32 GB
Memory channels: 2   ECC: No
PCIe version: 2.0   PCIe lanes: 16

Encryption

Data encryption standards supported by CPUs

AES-NI: No  

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

TDP: 65 W   Tjunction max.: --
TDP up: --   TDP down: --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 3.00 MB   Technology: 32 nm
Architecture: Sandy Bridge   Virtualization: None
Socket: LGA 1155   Release date: Q3/2011

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Used in: Unknown
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