Intel Celeron G5900 review - Specs and Benchmarks

Below are the basic specifications of the Intel Celeron G5900 processor developed on the Comet Lake architecture. The serial production start date Q2/2020, the technological process 14 nm, the clock frequency 3.40 GHz. The CPU has 2 cores, overclocked clock speed No turbo.
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the Intel Celeron G5900 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 3.40 GHz   CPU Cores: 2
Turbo (1 Core): No turbo   CPU Threads: 2
Turbo (2 Cores): No turbo   Hyperthreading: No
Overclocking: No  

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: Intel HD Graphics 610
GPU frequency: 0.35 GHz   GPU (Turbo): 1.05 GHz
Generation: 9.5   DirectX Version: 12
Execution units: 12   Shader: 96
Max. Memory: 32 GB   Max. displays: 3
Technology: 14 nm   Release date: Q3/2016

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: Decode / Encode
JPEG: Decode / Encode
h265 8bit: Decode / Encode
h265 10bit: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
VC-1: Decode
AVC: Decode / Encode

Memory & PCIe

The interfaces and standards of RAM that the Intel Celeron G5900 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR4-2666   Max. Memory: 128 GB
Memory channels: 2   ECC: Yes
PCIe version: 3.0   PCIe lanes: 16

Encryption

Data encryption standards supported by CPUs

AES-NI: Yes  

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

TDP: 58 W   Tjunction max.: 100 °C
TDP up: --   TDP down: --

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 2.00 MB   Technology: 14 nm
Architecture: Comet Lake   Virtualization: VT-x, VT-x EPT, VT-d
Socket: LGA 1200   Release date: Q2/2020
Market price: ca. 60 $  

Devices using this processor

Devices that can use this type of processor, desktop or laptop.

Used in: Unknown
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