AMD Ryzen 3 4100 review - Specs and Benchmarks

Below are the basic specifications of the AMD Ryzen 3 4100 processor developed on the Renoir (Zen 2) architecture. The serial production start date Q2/2022, the technological process 7 nm, the clock frequency 3.80 GHz. The CPU has 4 / 8 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the AMD Ryzen 3 4100 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: AMD Ryzen 3 4100   Segment: Desktop / Server
CPU group: AMD Ryzen 4000G
Family: AMD Ryzen 3   Generation: 3
Predecessor: AMD Ryzen 3 3100   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 3.80 GHz   Overclocking: Yes
Core architecture: normal  
CPU Cores / Threads: 4 / 8
Hyperthreading / SMT: Yes
Cores: 4x Zen 2
Turbo Frequency (1 Core): 4.00 GHz
Turbo Frequency (4 Cores): --

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: no iGPU
GPU (Turbo): No turbo   Max. GPU Memory: --
Direct X: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the AMD Ryzen 3 4100 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR4-3200   Max. Memory: 32 GB
Memory channels: 2 (Dual Channel)   ECC: Yes
Bandwidth: 51.2 GB/s
PCIe: 3.0 x 12
AES-NI: Yes

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: 100 °C   TDP up: --
TDP down: 45 W   TDP (PL2): --
TDP (PL1 / PBP): 65 W

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 4.00 MB   Technology: 7 nm
Architecture: Renoir (Zen 2)   Virtualization: AMD-V, SVM
Socket: AM4 (PGA 1331)   Release date: Q2/2022
Instruction set (ISA): x86-64 (64 bit)   L2-Cache: 2.00 MB
Part Number: --
ISA extensions: SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
Chip design: Chiplet
Operating systems: Windows 10, Windows 11, Linux
Release price: 99 $
Documents: Technical data sheet
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