AMD EPYC Embedded 3451 review - Specs and Benchmarks

Below are the basic specifications of the AMD EPYC Embedded 3451 processor developed on the Snowy Owl (Zen) architecture. The serial production start date Q1/2018, the technological process 14 nm, the clock frequency 2.14 GHz. The CPU has 16 / 32 cores, overclocked clock speed (no data).
Before choosing a CPU, check the socket type of the motherboard, the form factor of the RAM modules and the power of the power supply.

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Key data

Overview of the AMD EPYC Embedded 3451 processor, its main characteristics and performance in synthetic tests. You can compare two processors and choose the best one by evaluating the advantages and disadvantages of each.

CPU generation and family

Processor nomenclature, family, group and segment.

Name: AMD EPYC Embedded 3451   Segment: Desktop / Server
CPU group: AMD EPYC Embedded 3000
Family: AMD EPYC   Generation: 1
Predecessor: --   Successor: --

CPU Cores and Base Frequency

Characteristics affecting directly the performance of the processor. Operating frequency and frequency in turbo mode, overclocking, hypertrading number of cores and threads. The more the better.

Frequency: 2.14 GHz   Overclocking: Yes
Core architecture: normal  
CPU Cores / Threads: 16 / 32
Hyperthreading / SMT: Yes
Cores: 16x
Turbo Frequency (1 Core): 3.00 GHz
Turbo Frequency (16 Cores): --

Internal Graphics

The graphics chip allows the processor to perform complex calculation and display tasks. The more memory and the higher the clock frequency, the better. 

GPU name: no iGPU
GPU (Turbo): No turbo   Max. GPU Memory: --
Direct X: --

Hardware codec support

Technical information that will be of interest to specialists and does not affect the performance of the processor.

h264: No
JPEG: No
VP8: No
VP9: No
VC-1: No
AVC: No
h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
AV1: No

Memory & PCIe

The interfaces and standards of RAM that the AMD EPYC Embedded 3451 processor supports. The more modern the standard and the larger the memory capacity, the better.

Memory type: DDR4-2666   Max. Memory: 1024 GB
Memory channels: 4 (Quad Channel)   ECC: Yes
Bandwidth: 85.3 GB/s
PCIe: 3.0 x 64
AES-NI: Yes

Thermal Management

TDP is the maximum amount of heat generated by the processor. It is used when selecting a cooling system. The higher the TDP, the more heat the cooling system will have to dissipate.

Tjunction max.: 105 °C   TDP up: --
TDP down: 80 W   TDP (PL2): --
TDP (PL1 / PBP): 100 W

Technical details

Key processor parameters. Pay attention to the manufacturing process technology (measured in nanometers), second and third level cache (L2, L3), socket.

L3-Cache: 32.00 MB   Technology: 14 nm
Architecture: Snowy Owl (Zen)   Virtualization: AMD-V, SVM
Socket: SP4   Release date: Q1/2018
Instruction set (ISA): x86-64 (64 bit)   L2-Cache: 8.00 MB
Part Number: --
ISA extensions: SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
Chip design: Chiplet
Operating systems: Windows 10, Linux
Release price: --
Documents: Technical data sheet
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